LED/IC Wire Bonding
Special Measurement Microscope
--Loop Height / Mashed Ball Thickness / Ball Diameter Measuring
--Die adhesive thickness / Die Height / Adhesive Dispensing Thickness Measuring
Specification:
1,XYZ axis all manually operation.
2,XYZ axis all with 0.1um high precision gratings.
3,Repeatability XY:2um, Z:3um.
4,XY accuracy is 2um, Z is 3um.
5, Z axis measuring Height(Z axis displacement) ,at 500X magnification depth of focus is 1.5um.
6,stroke:x200*y100*z150mm
Measuring result demo:
measuring times | D1 | D2 | D3 | D4 | D5 |
1 | 0.152 | 0.017 | 0.277 | 0.028 | 0.033 |
2 | 0.152 | 0.018 | 0.278 | 0.031 | 0.035 |
3 | 0.152 | 0.019 | 0.277 | 0.03 | 0.033 |
4 | 0.153 | 0.018 | 0.277 | 0.029 | 0.033 |
5 | 0.151 | 0.019 | 0.275 | 0.029 | 0.033 |
6 | 0.152 | 0.019 | 0.277 | 0.031 | 0.034 |
7 | 0.152 | 0.019 | 0.276 | 0.03 | 0.033 |
8 | 0.153 | 0.019 | 0.278 | 0.03 | 0.034 |
9 | 0.151 | 0.018 | 0.277 | 0.03 | 0.035 |
10 | 0.153 | 0.018 | 0.277 | 0.031 | 0.033 |
Repeatability | 0.002 | 0.002 | 0.003 | 0.003 | 0.002 |
--can out put to Excel.
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cell:008615813334038